(footprint "BONDING_R30X10"
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(layer "F.Cu")
	(descr "0.3mm x 0.1mm Bonding Pad")
	(property "Reference" "REF**"
		(at 0 -0.95 0)
		(layer "F.SilkS")
		(uuid "35668260-228f-4c90-9936-990d09b61014")
		(effects
			(font
				(size 1 1)
				(thickness 0.2032)
			)
		)
	)
	(property "Value" "BONDING_R30X10"
		(at 0 0.95 0)
		(layer "F.Fab")
		(uuid "e0cda6a7-6866-48de-b8a2-2b1b4b0d560b")
		(effects
			(font
				(size 1 1)
				(thickness 0.2032)
			)
		)
	)
	(property "Datasheet" ""
		(at 0 0 0)
		(layer "F.Fab")
		(hide yes)
		(uuid "053722a4-9d65-4dd5-9287-7a381ea21945")
		(effects
			(font
				(size 1 1)
				(thickness 0.2032)
			)
		)
	)
	(property "Description" ""
		(at 0 0 0)
		(layer "F.Fab")
		(hide yes)
		(uuid "ec0f2b8f-e6ba-4926-b93f-ad54716bd621")
		(effects
			(font
				(size 1 1)
				(thickness 0.2032)
			)
		)
	)
	(attr allow_missing_courtyard)
	(pad "1" smd rect
		(at 0 0)
		(size 0.3 0.1)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_mask_margin 0.1)
		(solder_paste_margin -0.15)
		(uuid "34a4c682-5356-4d1d-b503-33a230794af8")
	)
	(pad "L" smd rect
		(at 0 0)
		(size 0.3 0.1)
		(layers "In1.Cu")
		(solder_paste_margin -0.15)
		(uuid "c9b0989f-3cdc-4547-a5a0-e346661ac206")
	)
	(embedded_fonts no)
)