(footprint "BONDING_R8X20"
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(layer "F.Cu")
	(descr "0.08mm x 0.20mm Bonding Pad")
	(property "Reference" "REF**"
		(at 0 -0.95 0)
		(layer "F.SilkS")
		(uuid "244557ea-1a8f-44b8-af13-c4a2f303cfa1")
		(effects
			(font
				(size 1 1)
				(thickness 0.2032)
			)
		)
	)
	(property "Value" "BONDING_R8X20"
		(at 0 0.95 0)
		(layer "F.Fab")
		(uuid "4f49e516-9628-409c-a601-9d332cda8251")
		(effects
			(font
				(size 1 1)
				(thickness 0.2032)
			)
		)
	)
	(property "Datasheet" ""
		(at 0 0 0)
		(layer "F.Fab")
		(hide yes)
		(uuid "d01edd23-1a7b-4f74-90f7-ddf55779c50c")
		(effects
			(font
				(size 1 1)
				(thickness 0.2032)
			)
		)
	)
	(property "Description" ""
		(at 0 0 0)
		(layer "F.Fab")
		(hide yes)
		(uuid "80deb562-b786-40f0-bd1f-204bff69bd96")
		(effects
			(font
				(size 1 1)
				(thickness 0.2032)
			)
		)
	)
	(attr allow_missing_courtyard)
	(pad "1" smd rect
		(at 0 0)
		(size 0.08 0.2)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_mask_margin 0.1)
		(solder_paste_margin -0.15)
		(uuid "f66c62d8-75c5-40d3-bd1b-7b9d7dd12f7f")
	)
	(pad "L" smd rect
		(at 0 0)
		(size 0.08 0.2)
		(layers "In1.Cu")
		(solder_paste_margin -0.15)
		(uuid "1bc46728-c115-41cc-bd2f-993ae1c302e2")
	)
	(embedded_fonts no)
)