- Also fixed an issue where NewLib ROM APIs, when called from TEE, were
using the syscall table located in the REE SRAM. This could be abused
as an attack vector to invoke illegal functions from the TEE.
To prevent this, the syscall table is now switched to the TEE-specific
copy during every M-U mode transition.
Currently, REE SPI flash HAL operations are routed as service calls to TEE,
but the TEE implementation incorrectly uses ROM APIs instead of HAL APIs.
This leads to issues and is not the recommended approach.
esp_stdio contains everything the old esp_vfs_console contained (the vfs stdio glue layer)
as well as other functionality related to stdio (previously referred to as console)
- Previously, only the U-mode interrupt threshold was raised in REE critical sections,
leaving M-mode at the lowest level.
- As a result, when a service call transitioned to M-mode, all interrupts were still
allowed to fire, including those that should have been masked.
- Remove GPTIMER and TIMG related definitions from soc_caps_full.h files
- Move timer peripheral definitions to appropriate HAL layer files
- Update references across components to use proper HAL abstractions
- Consolidate timer group and GPTIMER capabilities organization
- Ensure consistent timer configuration across all ESP32 variants
This refactoring improves the separation of concerns between SOC
capabilities and HAL implementations for timer-related functionality.
- Ensure bound checks correctly handle all scenarios, including
when a requested operation's (SPI0/1) range fully contains the
TEE-protected region.
- Disable delegation of INTWDT timeout and Cache error interrupts as they reset
the device after the panic handler
- Fix incorrect setting in the edge interrupt acknowledgement API
- Avoid executing the service call dispatcher in the U-mode ecall,
rather execute `mret` to jump it
- Avoid `t1` register corruption when processing `ecall`
- Switch back to the bootloader stack from TEE stack after the
execution of the entire TEE initialization routine
- Rename `tee_test_fw` app configs for better CI tracking
- Decrease the lower bound of TEE I/DRAM config options
- Trim the TEE test-apps build
- Improve the TEE/REE OTA pytest script with additional checks
- Fix build issues when `tee_sec_storage`/`tee_ota_ops` are a
a part of the project build but ESP-TEE is disabled
This commit refactors the esptool_py component to provide utility
functions for binary file generation targets instead of creating the
targets. Binary generation targets are now moved to the respective
projects.
The following changes were done in this commit:
- Added __idf_build_binary() function to esptool_py to create the binary
file generation target.
- Added __idf_build_secure_binary() as the secure boot equivalent of the
above function.
- Top level project build now creates its own binary targets in
idf_build_executable() in build.cmake.
- Bootloader and esp_tee subprojects create their binary file generation
targets in their respective CMakeLists.txt files.
- All post-build targets such as the app_size_check target are now
created by the respective projects and not esptool_py.
- General clean-up of the esptool_py cmake files.
- Place the APM HAL into TEE IRAM when `CONFIG_SECURE_TEE_EXT_FLASH_MEMPROT_SPI1`
is enabled, as APM violations related to SPI1 can occur with the flash cache disabled.
- Also fix an issue where flash protection tests were passing due to incorrect checks
- Decreased from 32KB to 24KB, keeping in mind the current maximum TEE heap
usage and some overhead
- Make the TEE panic handler logs concise, saving some DRAM
Laukik Hase
Ashish Sharma
Alexey Lapshin
Mahavir Jain
Marius Vikhammer
morris
Peter Dragun
Marek Fiala
Sudeep Mohanty
Aditya Patwardhan
harshal.patil