- Also set the RX burst size correctly for AES/SHA DMA operations
with ESP-TEE
- Fix the compile-time minimum chip revision check for patching
the `ets_delay_us` API
Currently, REE SPI flash HAL operations are routed as service calls to TEE,
but the TEE implementation incorrectly uses ROM APIs instead of HAL APIs.
This leads to issues and is not the recommended approach.
- When NVS encryption is enabled on SoCs with the HMAC peripheral that have flash encryption
enabled, the HMAC-based NVS encryption scheme is now selected as default instead of the
flash encryption-based scheme.
- If your application previously used the flash encryption-based scheme, you need to manually
configure the NVS encryption scheme to flash encryption from HMAC through ``menuconfig``
or your project's ``sdkconfig`` (i.e., setting ``CONFIG_NVS_SEC_KEY_PROTECT_USING_FLASH_ENC=y``).
- Rename `tee_test_fw` app configs for better CI tracking
- Decrease the lower bound of TEE I/DRAM config options
- Trim the TEE test-apps build
- Improve the TEE/REE OTA pytest script with additional checks
- Fix build issues when `tee_sec_storage`/`tee_ota_ops` are a
a part of the project build but ESP-TEE is disabled
- Decreased from 32KB to 24KB, keeping in mind the current maximum TEE heap
usage and some overhead
- Make the TEE panic handler logs concise, saving some DRAM