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cern-kicad-libs/PcbLib/Pads.pretty/BONDING_R30X10.kicad_mod
T
2026-03-10 20:41:22 +01:00

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(footprint "BONDING_R30X10"
(version 20241229)
(generator "pcbnew")
(generator_version "9.0")
(layer "F.Cu")
(descr "0.3mm x 0.1mm Bonding Pad")
(property "Reference" "REF**"
(at 0 -0.95 0)
(layer "F.SilkS")
(uuid "35668260-228f-4c90-9936-990d09b61014")
(effects
(font
(size 1 1)
(thickness 0.2032)
)
)
)
(property "Value" "BONDING_R30X10"
(at 0 0.95 0)
(layer "F.Fab")
(uuid "e0cda6a7-6866-48de-b8a2-2b1b4b0d560b")
(effects
(font
(size 1 1)
(thickness 0.2032)
)
)
)
(property "Datasheet" ""
(at 0 0 0)
(layer "F.Fab")
(hide yes)
(uuid "053722a4-9d65-4dd5-9287-7a381ea21945")
(effects
(font
(size 1 1)
(thickness 0.2032)
)
)
)
(property "Description" ""
(at 0 0 0)
(layer "F.Fab")
(hide yes)
(uuid "ec0f2b8f-e6ba-4926-b93f-ad54716bd621")
(effects
(font
(size 1 1)
(thickness 0.2032)
)
)
)
(attr allow_missing_courtyard)
(pad "1" smd rect
(at 0 0)
(size 0.3 0.1)
(layers "F.Cu" "F.Mask" "F.Paste")
(solder_mask_margin 0.1)
(solder_paste_margin -0.15)
(uuid "34a4c682-5356-4d1d-b503-33a230794af8")
)
(pad "L" smd rect
(at 0 0)
(size 0.3 0.1)
(layers "In1.Cu")
(solder_paste_margin -0.15)
(uuid "c9b0989f-3cdc-4547-a5a0-e346661ac206")
)
(embedded_fonts no)
)