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cern-kicad-libs/PcbLib/Pads.pretty/BONDING_R8X20.kicad_mod
T
2026-03-10 20:41:22 +01:00

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(footprint "BONDING_R8X20"
(version 20241229)
(generator "pcbnew")
(generator_version "9.0")
(layer "F.Cu")
(descr "0.08mm x 0.20mm Bonding Pad")
(property "Reference" "REF**"
(at 0 -0.95 0)
(layer "F.SilkS")
(uuid "244557ea-1a8f-44b8-af13-c4a2f303cfa1")
(effects
(font
(size 1 1)
(thickness 0.2032)
)
)
)
(property "Value" "BONDING_R8X20"
(at 0 0.95 0)
(layer "F.Fab")
(uuid "4f49e516-9628-409c-a601-9d332cda8251")
(effects
(font
(size 1 1)
(thickness 0.2032)
)
)
)
(property "Datasheet" ""
(at 0 0 0)
(layer "F.Fab")
(hide yes)
(uuid "d01edd23-1a7b-4f74-90f7-ddf55779c50c")
(effects
(font
(size 1 1)
(thickness 0.2032)
)
)
)
(property "Description" ""
(at 0 0 0)
(layer "F.Fab")
(hide yes)
(uuid "80deb562-b786-40f0-bd1f-204bff69bd96")
(effects
(font
(size 1 1)
(thickness 0.2032)
)
)
)
(attr allow_missing_courtyard)
(pad "1" smd rect
(at 0 0)
(size 0.08 0.2)
(layers "F.Cu" "F.Mask" "F.Paste")
(solder_mask_margin 0.1)
(solder_paste_margin -0.15)
(uuid "f66c62d8-75c5-40d3-bd1b-7b9d7dd12f7f")
)
(pad "L" smd rect
(at 0 0)
(size 0.08 0.2)
(layers "In1.Cu")
(solder_paste_margin -0.15)
(uuid "1bc46728-c115-41cc-bd2f-993ae1c302e2")
)
(embedded_fonts no)
)